Hello Mike, An underfill encapsulant will certainly help the improve the reliability performance of a ceramic package assembled on an organic board, both for survival of thermal cycle requirements and for mechanical stresses like vibration and shock. Process considerations are: Dispensability Underfill Flow rate Cure time and temperature Pot Life Other pertinent considerations are: Material properties: Tg CTE Modulus Reliability: Tests Conditions Pass/Fail criteria Zymet manufactures underfill encapsulants for a broad range of applications. They can be contacted at [log in to unmask] or you can email me directly Regards, Karl Zymet --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------