Hello Mike,

An underfill encapsulant will certainly help the improve the reliability
performance of a ceramic package assembled on an organic board, both for
survival of thermal cycle requirements and for mechanical stresses like
vibration and shock.

Process considerations are:

Dispensability
Underfill Flow rate
Cure time and temperature
Pot Life

Other pertinent considerations are:

Material properties:
Tg
CTE
Modulus

Reliability:
Tests
Conditions
Pass/Fail criteria

Zymet manufactures underfill encapsulants for a broad range of
applications.  They can be contacted at [log in to unmask] or you can email me
directly

Regards,
Karl
Zymet

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