Hello, for years, we have been using Indium's 51C, RMA solder paste. We have struggled for years to clean off all the paste residue that is left behind, especially that left under tight fitting components. Because we are a NASA/Govt manufacture, we have always used RMA paste and cleaned with solvent to remove residue. All of our assemblies have to meet the IPC cleanliness requirements, and some customers want to take it a step further and meet the NASA out gassing requirements as well. Because we have problems with trapped flux under some components, Indium has recommended that we switch to their 92H paste. This RMA paste is classified as a No Clean, but has a Rosin base that cleans well with solvents. The cleaner that I use is a Detrex (in line spray under immersion) cleaner and the solvent is Kyzen’s I-3330. I would like to know if anyone else has been using this combination and if you had any problems qualifying the solder paste? Is there any qualifying data for solder-ability or cleaning available for this combination that someone would be able to share? Any help here would be appreciated. Thanks in advance, Jack --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------