TechNet team,

I have an application where a LCCC (CTE = 7.6 ppm/°C) is to be soldered on
to a Rogers Corp Duroid substrate (CTE = 24 ppm/°C).  I know how to do the
length differential calculation over temperature, but what criteria do I use
to say whether the differential is OK or not OK?  I could also do a stress
calculation on the solder joints, but I don't have a value for Young's
Modulus of the solder to plug in.

If you have rules of thumb or past experience to share, I'd appreciate
hearing from you.

Thanks,

Rich MacConnell
Mechanical Engineer
Northrop-Grumman

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