Good morning Guy, Would you mind sharing some specifications regarding this "gadget". I have looked into a "Mole" wave profiler but I find it very expensive. Thanks, Eric -----Message d'origine----- De : TechNet [mailto:[log in to unmask]] De la part de Guy Ramsey Envoyé : 12 janvier, 2004 08:33 À : [log in to unmask] Objet : Re: [TN] Comment on Wave Solder Profile Method Assembly Profile development: The method is sloppy but probably works okay most of the time. What do they do when the results are bad? Machine maintenance: Once a good profile has been established the task becomes verification of process stability. Machine controls do drift over time. Manufacturers of wave solder equipment usually recommend a schedule for verification of preheat, conveyor, solder pot, flux density and other controls. I used a gadget to check preheat temperature, conveyor speed, solder pot temperature, and wave dynamics every morning. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Bogert > Sent: Saturday, January 10, 2004 9:10 AM > To: [log in to unmask] > Subject: [TN] Comment on Wave Solder Profile Method > > > January 10, 2004 > > Folks, I am aware of an OEM who establishes his wave solder > profiles by using an unpopulated printed wiring board, which > has thermocouples attached on the solder destination side. > After the profile is completed, a first piece assembly is 100 > percent visually inspected, and if the results are OK, the > prifile is saved and logged in document control, and unless > there are solder problems on subsequent production units, > that specific assembly part number is normally never solder > profiled again. The machine setup (e.g. speed, temperature > sensors, etc are in the periodic calibration program). For > reflow profiling, the OEM uses an actual printed wiring > assembly with thermocouples attached. > > I have several questions on solder profiling, as follows: > > 1. I am not aware of any IPC or military specification > requirement that mandates any specific method for solder > profiling, or for how often (if ever) a profile needs to be > repeated once it has bewen established for a given part > number assembly. > > 2. I am aware of all flavors of solder profiling (e.g., > machine profile just using the built in solder machine > sensors; machine profile using just temperature dots on the > top side of the printed wiring assembly; machine profile > using a mole or other type of instrumented device; and > thermocouples on an actual printed wiring assembly). It > appears that as long as one gets an acceptable solder joint, > any of these methods are acceptable for profiling wave solder. > > What method do you folks use for profiling for reflow and > wave solder? Is wave solder profile using the unpopulated > printed wiring board an acceptable method? If one continues > to get acceptable solder joints, how often (if ever) do folks > repeat a solder profile on a given part --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------