'Morning Fellow Techies, Does anyone have any experiences with the process of underfill to help protect solder interconnects from the effects of thermal expansion mis-match between a ceramic substrate and the FR4 board? If so, what are some of the considerations to think about? Thanks if Advance, Michael Laroe Mfg. Engineer MSL-Lowell (978)677-2977 (v) (978)454-9200 (f) [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------