I understand that Infineon has adopted this Ni underplating strategy extensively for their Pb-Free line. Rich Kraszewski Advanced Manufacturing Engineer - KEDS Phone: 260.925.8919 Pager: 812.481.3492 -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Guenter Grossmann Sent: Monday, January 26, 2004 11:39 AM To: [log in to unmask] Subject: Re: [TN] Antw: [TN] Lead-free Component Finishes Jim I was talking last week with a person from Motorola Germany and a someone from Collini. In the discussion both told me that by using a Ni- underplate and with the appropriate plating chemistry they don't' see problems with whiskers anymore. Earlier, in a conference from Electrosuisse, I had a discussion with a speaker talking about whisker growth as a function of grain size of the Sn plating which can be controlled with the appropriate chemistry and process parameters. What I learned in these discussion was that whiskers are a problem that can be controlled. In the worst case, in my understanding, it's a question of money. Annealing the plating can reduce the internal stress in the plating and diminish whisker growth. Wrong? Best regards Guenter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------