J-STD-001C Class 3 requirements might be sufficient. Appendix B of J-STD-001C might be the trick. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Ken Patel > Sent: Thursday, January 15, 2004 1:23 PM > To: [log in to unmask] > Subject: [TN] No Clean solder paste note for > Telecom/Networking products > > > Experts, > > If I have to allow my CM to use No Clean solder paste, what > kind of note should I put on assembly drawing (with some kind > of qualification requirement)? Our product is for > telecom/networking industry so I rather specify some kind of > qualification requirements (if any) than just write - use no > clean solder paste. I know all pastes are not same and may > not be suitable for certain industry. > > > > I used to put a note on my assembly drawing for hand > soldering something like... > > > > HAND SOLDER FOLLOWING COMPONENTS USING TELCORDIA (BELCORE) > COMPLIANT NO-CLEAN FLUX. > > > > Any help will be appreciated. Thanking you in advance. > > > > Re, > > Ken Patel > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------