I know that 0402 is a mature technology. I am getting ready to do a board which will use all 0402 passives. I have very little experience with 0402. From what I have been reading it seems very important that components go through the oven broadside so that both sides go liquidous at the same time. I also have read that it is important to keep the copper or thermal structures as close as possible on both sides. What I was hoping to ask is from the experience of people is this really the case anymore. It is very difficult to lay out a board with all of the passives facing the same direction. The copper or thermal on both sides is very much less difficult. Any input on this subject would really be appreciated. Thank You John Foster --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------