James 1) BGA's SnAgCu Passive : Sn looks like the candidate specially since the whisker problem seems to be about to be solved IC's: Sn or PaAu 2) BGA's: You can solder SnAgCu balls with SnPb. However, one can observe Pb contamination along the grain boundaries. Dave Surarski reported early failures due to that. I couldn't say jet. We are testing. All the other components can be soldered with SnPb without a problem. 3) Military is excluded of RoHS (at the moment). What do you mean with commercial? Look for the RoHS in the web. I don't know the address but Google finds it easy if you look for RoHS. Best regards Guenter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------