Greetings All, I am having my first experience working with an assembly design that involves 0402 capacitors with underside solderable terminations (vice wrap-around end terminations)... The reflow process seems to cause the components to tilt and skew to highly unacceptable levels. Physically it looks as if the caps floated to the top of the molten solder volume (as if on pontoons) then slid down one way or the other. The vendor made a few recommendations including migration to a thinner (4 mil) stencil as well as some pad design and nitrogen tweaks and... Even after implementing these recommendations we are experiencing the same problems, just to a slightly lesser (although still unacceptable) degree... Does anyone out there have any additional thoughts on how to remedy this sort of issue? We do build another part [successfully] with a similar style component, but it is a 1206 form factor and is perhaps massive enough to keep from floating up the way the 0402 caps do... Your collective wisdom is greatly appreciated! Best Regards, Tom Ochenas Process Engineering Maxtek Components Corporation 2905 SW Hocken Avenue Beaverton, OR 97005 [log in to unmask] desk: 503-627-3078 fax: 503-627-4651 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------