The 2 oz. copper will be roughly 2.8 mils. But is it RA or ED? ED, electro deposited, tooth will bury into the coated polyimide, Kapton, film if adhesiveless. But if an adhesive based laminate is used then how much? Another question, How did you get 1.5 mil photo coverlay to fill 2 ounce copper, you should have a lot of trapped air. Chuck Brummer Siemens Medical Solutions -----Original Message----- From: Bissonnette, Jean-Francois [mailto:[log in to unmask]] Sent: Friday, December 19, 2003 7:59 AM To: [log in to unmask] Subject: [TN] Flex circuit information needed I would like to know how to calculate the thickness of a flex circuit assembly. Here are the informations I have Base: .002 thk polymide (kapto) 2 OZ Copper Clad Laminate, both sides Coverplate: .0015 flexible photoimageable coverlay (both sides) It's obvious that I'll end up with 2x0.0015 + 2x0.002 for the first and last Item, but how can I get the thickness of the copper laminate? Thanks! Jean-François Bissonnette Vérificateur, Contrôle de la Qualité Électronique Produits et Procédés Vapor Rail Inc. 10655 Henri-Bourassa O. St-Laurent, Qc H4S 1A1 (514) 335-4200 x2021 (514) 335-4231 fax ***** CONFIDENTIALITY NOTE ***** The content contained in this e-mail transmission is legally privileged and confidential information intended only for the use of the individual or entity named herein. If the reader of this transmission is not the intended recipient, you are hereby notified that any dissemination, distribution, or copying of this transmission is strictly prohibited. --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------