Susan, Victor We have pictures of - SnAg3.8Cu0.7 - SnAg3.5 - SnZn9 - SnBi57 Some of them are published in: - No fear of Lead Free Solder, 21. ICEC 2002, Zurich. ISBN 3-9522504-0-6 - Results of Comparative Reliability Tests on Lead Free Solder, 52 ICTC San Diego 2002, ISSN 0569- 5503 More publications are in preparation. Best regards Günter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------