Oops, I didn't read the original question very well, I thought you were referring to QFP's instead of CSP, therefore my earlier answer doesn't make much sense. Sorry. Daan Terstegge ----- Original Message ----- From: "d. terstegge" <[log in to unmask]> To: <[log in to unmask]> Sent: Monday, December 15, 2003 4:34 PM Subject: Re: [TN] .5 mm pitch components > Hi Ted, > > Padsizes you can find in IPC-SM-782 or IPC's online footprint > calculator. 12 mil width is standard, anything smaller than that may > result in problems with paste printing. This leaves hardly any space for > a good solder mask stripe, therefore it is quite common to have one > large soldermask window around each row of pads, although some would > argue that you need soldermask between each individual pad to get good > gasketing of the stencil while printing solder paste. You may need the > inner layers for the fan-out pattern, but that doesn't mean you need > via-in-pad. When possible use ordinary via's for this. > Hope this helps. > > Daan Terstegge > Thales Communications > Unclassified mail > Personal Website: http://www.smtinfo.net > > >>> [log in to unmask] 12/14/03 02:59am >>> > Hi all, > > Want to find out what pad size and solder mask opening > are people using for .5 mm pitch components? Since > the pad size is so small, it is a must to use solder > mask define pads? Are people using via-in-pads to get > traces out or just using the outer layers? Thanks all > in advance. > > Ted Kong. > > __________________________________ > Do you Yahoo!? > New Yahoo! Photos - easier uploading and sharing. > http://photos.yahoo.com/ > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------