Kat, I have this type of damage in some BGA. However, this shared artifact take the cake. In PCB/PWB there is a 0.030 keep out zone from edhe of card . No too sure how that applies here. The rough edge is a sure point for MOISTURE INGRESS into the compromised laminate edge. Very curious on what ruling you receive for supporting document. Let me guess that the supplier is OVERSEAS. Victor, -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Kathy Kuhlow Sent: Thursday, December 18, 2003 3:49 PM To: [log in to unmask] Subject: [TN] Need your opinion I need your opinion on the delamination on the edges of these BGA devices. Steve was nice enough to post the photo's I have on his website. The pictures are numbered as: MVC1-MVC3. They can be found at: http://www.stevezeva.homestead.com Kat --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------