Technet Members,
     We have identified a field return trend in a line of circuit boards.  The problem is occurs which a trace separates from the plated through hole
causing an open circuit.  Unfortunatly, we had to destructively analyze two boards to reach this solution.  The failure analysis points to a
manufacturing defect that will potentially affect an entire lot of boards.  We are looking for a non-destructive way to analyze this lot of boards to
determine whether or not a particular board suffers from a partially or intermittant open condition, on its way to becoming a hard open.  Any
recommendations would be greatly appreciated.  Thanks in advance...

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