Reiven: Pro: Coats everything and seals it. Con: Slow process, lots of equipment upkeep, Some board usage needs this type of CC, most do not. Regards, Ramon > -----Original Message----- > From: TechNet [SMTP:[log in to unmask]] On Behalf Of Reuven ROKAH > Sent: Sunday, December 14, 2003 2:54 AM > To: [log in to unmask] > Subject: [TN] Conformal coating - PARYLENE DIMER DPX-C > > Hi Perylene users, > > Can you share with your experience and inform the + and - of this process? > > I have last week visited one of the users site and it seems promising. > > I have long experience with spraying systems and not vacuum systems. > > Best Regards > > Reuven > > > > > Graham Naisbitt > <Graham.Naisbitt@CON To: [log in to unmask] > COAT.CO.UK> cc: > Sent by: TechNet Subject: Re: [TN] Foreign material on top of the conformal coating > <[log in to unmask]> > > > 12/12/2003 18:02 > Please respond to > "TechNet E-Mail > Forum."; Please > respond to Graham > Naisbitt > > > > > > Bruce > > If you are applying epoxies and other materials after conformal coating, > just be sure that the solvents (if any) are not affecting the coating > during > their application and curing. > > Otherwise this should simply be regarded as a cosmetic issue. > > Cleaning after all these processes is unlikely to be a good option, as the > coating will now be expected to withstand your cleaning process...and > surface cleaning using brushes, swabs etc., are only likely to be moving > the > stuff around on the surface rather than removing it. > > Hope this helps > -- > Regards Graham Naisbitt > > [log in to unmask] > > Cell: 079 6858 2121 > Office: +44 (0)1252 813706 > > Concoat Limited - Engineering Reliability in Electronics > > NEW - HumiSeal 1H2O Bov Aerosol - NEW > > Web: www.concoat.co.uk and www.concoatsystems.com > > > > Hey guys, > > I have be hit recently on a couple of occasions by the quality folks > > over "foreign material" that is present on CCA's after conformal coating. > > On quite a few boards we install heat sinks after CC and usually use an > > epoxy to aid in heat transfer as well as loctite on the mounting screws. > I > > have been gigged for the residuals (just smears really) whether it is on > > the solder pads or not. I know that we all are concerned with material > > left over directly on the solder connections, but I am having trouble > with > > this one from a logical standpoint. I mean lets face it, you definitely > > can't test for the presence of ionic contaminants or anything, but I know > > the general impression is the boards should be clean. > > > > I know the simple answer here is to clean up all the residuals (and > > everyone is instructed to do that), but there are times when stuff just > > happens. > > > > Your thoughts > > > > Bruce Stilmack > > GDLS-TO Manufacturing Engineer > > (850) 574-4773 > > [log in to unmask] > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > > To unsubscribe, send a message to [log in to unmask] with following text in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: > http://listserv.ipc.org/archives > > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for > > additional information, or contact Keach Sasamori at [log in to unmask] or> > > 847-509-9700 ext.5315 > > ----------------------------------------------------- > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------