Good afternoon all, Internally, we are having discussions on the amount of allowable overhang of passive SMT components (R and C). Our specifications are based on solder joint connections and the solder specifications are not in question. We have an application where a silver filled adhesive is used to make the connection between SMT metalization and mounting pad. The solder joint requirements were applied to these adhesive joints and I am wondering as to the validity of this. The adhesive is epoxy based and, in my mind, more rigid than solder. I think we are unnecessarily rejecting parts that are acceptable. So, before I go off and do a complex designed experiment, I thought I would check with the Technet crowd first. Do you know of any studies that show the adhesive force (e.g. pull strength) vs. the degree of pad overhang? Doug Pauls Rockwell Collins --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------