Hello, Will you please explain why solder paste would be a more likely culprit for voiding? Thank you, David Tremmel >From: Mel Parrish <[log in to unmask]> >Reply-To: "TechNet E-Mail Forum." <[log in to unmask]>, Mel >Parrish <[log in to unmask]> >To: [log in to unmask] >Subject: Re: [TN] Old Array Devices >Date: Tue, 9 Dec 2003 08:46:38 -0600 > >Good morning Bev, >I can recall some FA studies where oxidation of the ball was considered a >contributor to voiding at the sphere interface and visual surface >appearance >of the ball after reflow. Albeit solder paste is a more likely culprit for >voiding. >Stay warm! > >Best regards, > >Mel Parrish >Soldering Technology International Inc. >Madison, AL > >-----Original Message----- >From: TechNet [mailto:[log in to unmask]]On Behalf Of Bev Christian >Sent: Monday, December 08, 2003 10:45 AM >To: [log in to unmask] >Subject: [TN] Old Array Devices > > >Good morning, >Have any of you ever seen an array device that did not solder because of >oxidation of the eutectic solder balls on the device? To be clear, I am >excluding organic contamination, insufficient reflow temperature >conditions, >poor paste, poor boards, misregistration, etc. - just considering >oxidation. >Thanks. > >Bev Christian >Research in Motion > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >----------------------------------------------------- > >--------------------------------------------------- >Technet Mail List provided as a service by IPC using LISTSERV 1.8e >To unsubscribe, send a message to [log in to unmask] with following text in >the BODY (NOT the subject field): SIGNOFF Technet >To temporarily halt or (re-start) delivery of Technet send e-mail to >[log in to unmask]: SET Technet NOMAIL or (MAIL) >To receive ONE mailing per day of all the posts: send e-mail to >[log in to unmask]: SET Technet Digest >Search the archives of previous posts at: http://listserv.ipc.org/archives >Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 >for additional information, or contact Keach Sasamori at [log in to unmask] or >847-509-9700 ext.5315 >----------------------------------------------------- _________________________________________________________________ Cell phone ‘switch’ rules are taking effect — find out more here. http://special.msn.com/msnbc/consumeradvocate.armx --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------