Hi Kath, Its a delamination issue, which should be comply to IPC 610 Std. (area size, distance between conductors etc.) Its location on the PCB edge make it more problematic to humidity. Best Regards ROKAH Reuven Kathy Kuhlow <[log in to unmask] To: [log in to unmask] OM> cc: Sent by: TechNet Subject: Re: [TN] Need your opinion <[log in to unmask] > 19/12/2003 00:11 Please respond to "TechNet E-Mail Forum."; Please respond to Kathy Kuhlow No, brand new design and revision for a customer of ours. We have had nothing but issues with the manufacturer like this and have seen really odd things happen during reflow. We have received so many with edge damage like this that I had to ask if this is normal and I am being anal or is this a problem with the supplier. The sad part is that the customer is designing around this device so we will be stuck with this kind of quality unless I really push and drag my feet right now. I need some unbiased opinions on the issues. Some issues get to the point that you almost have to prove that your not whining and this isn't right. I am forwarding all responses to them for further evaluation. Kat >>> [log in to unmask] 12/18/03 04:05PM >>> Hi Kat! Are these re-balled BGA's? -Steve Gregory- > I need your opinion on the delamination on the edges of these BGA devices. > Steve was nice enough to post the photo's I have on his website. The > pictures are numbered as: MVC1-MVC3. They can be found at: > > http://www.stevezeva.homestead.com > > Kat > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------