Sergey, Sn96.5/Ag3.5 might do the trick, it's a eutectic alloy with a meltpoint of 221C. In order to get a robust profile, you will have to exceed your component 230C by a bit, but they should be forgiving enough. There's also AIM's Castin alloy, eutectic at 217C.... Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Sergey Ermolin Sent: Tuesday, December 16, 2003 10:04 AM To: [log in to unmask] Subject: [TN] high-temperature alloy and process for a multi-chip module Hi. I am desinging a multi-chip module. In my desing, two off-the-shelf IC's in TQFP packages are mounted on an FR-4 PCB. This board has a Land Grid Array footptint on the bottom and will be soldered to the motheboard using a standard reflow process with Sn63Pb37 alloy. What alloy and temperature profile would you recommend for assembling the multi-chip module itself? The chips on the module were not designed to withstand more than 230 deg C and are normally soldered using the same Sn63Pb37 alloy... Thank you for your help... Regards, Sergey Ermolin Dust, inc 2560 9th Street, #218 Berkeley, CA 94710 510/225-2137 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------