this is used for severely unbalanced (difference in cu area per sq/inch across the board) boards or backpannels where even cu deposits across the board are critical.
 
full panel plating would make etching very difficult / impossible
 
full pattern plating causes severe differences in cu thickness
 
hence the compromise
 
hope this helps
 
Wolfgang
----- Original Message -----
From: [log in to unmask] href="mailto:[log in to unmask]">Ian Shute
To: [log in to unmask] href="mailto:[log in to unmask]">[log in to unmask]
Sent: Wednesday, November 05, 2003 3:21 PM
Subject: [TN] Pattern & panel plating why both ?

All,

 

Any insight as to why a PCB house would panel then pattern plate a board?

 

My mis-guided time in the industry has lead me to believe it’s one or the other?

 

Thanks

 

Ian

 

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