I am in the middle of a discussion/debate with
assemblers on one side and
designers on the
other.
The question is:
What would your shop prefer to receive from the
designer for soldermask features?
either
A) 1:1? (Soldermask clearance same as the
holesize, padsize, surfacemount, or
clearanced feature size)
or
B) Soldermask Clearance set at some value over the
pad/feature/SMT size?
(Like 3 mils per
side)
Thanks for any and all responses,
David Hoover
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