Danny Solder strength is not defined quantitatively. That's why you don't find standards. Usually the ENIG-solder interface is the week point in a solder joint. But, as Werner already pointed out, this bond is good (the chemical reaction of the solder with the substrate took place) or it isn't. All you can do is an analysis of this interface. Werner pointed one out. A crude possibility is ripping of the components with a screw driver ---> But don't use any comments of the force necessary as a criteria. After removal of the components you need to look close (SEM, 500x magnification) at the interface. If the bond was ok you will see signs of plastic deformation and, in BGA joints the path of the rupture is along the interface of the component. If the solder connection is week the rupture is on the PCB side and the surface will be flat with the appearance of dried mud. As I said, this is a 0-order approach to find the worst cases since the rupturing behaviour depends on the stress applied. You might also find plastic deformation and brittle fracture on one pad indication that only part of the pad has alloyed with the solder. Well, that's the point of a decision whether you can live with that situation at the moment. It is in any case a sign that the ENIG process runs in a critical zone and you need to speak with your PCB vendor who might advice you to define more sophisticated analysis or help to optimize your soldering process. Guenter EMPA Swiss Federal Laboratories for Materials Testing and Research Centre for Reliability Guenter Grossmann, Senior Engineer 8600 Duebendorf Switzerland Phone: xx41 1 823 4279 Fax : xx41 1 823 4054 mail: [log in to unmask] --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------