Hi Bill! Boy, talk about a weird Monday! We had tornado watches here until 1:00pm! Anyhoo, I digress... Gold bumping, here's a few links that talk about it: http://www.secap.org/tech4.php http://www.chipbond.com.tw/eng/Gold%20Bumping.htm http://www.microfabtech.com/goldbumps.html -Steve Gregory- > Hi, > I am looking at a sample board done with 'gold bumps' in the centers of the > pads to allow surface to surface mounting of 2 boards. Anyone have a 'clue' > how this is done? How it gets used? > I have not seen this before and would like to learn about it. > > Bill Brooks > PCB Design Engineer , C.I.D., C.I.I. > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------