Bill, We did something like this 2-3 yrs back where we were making custom BGAs (MCMs). The BGA pads were raised by 4-6 mils above the rest of copper. This allowed for better BGA assembly. We were successful, but it was not easy and the idea never went into production. Call off-line and we can discuss this. Rashesh 818-768-3919 www.accueng.com --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------