Hi again Daan, Let's try this from another angle, Common Sense 101. I would look at the requirement in 6.1.1 that specifies that the component shall meet the part specification AND the intent behind the requirement in 9.2.6.8 Note 4 (that discusses the solder touching the pkg or seal). The intent of the requirement is to focus on what an excessive amount of solder does to the stress relief of the lead bend NOT that solder has wetted past the upper bend to the lead/body interface. Another hearty Good Luck. Steve -----Original Message----- From: d. terstegge [mailto:[log in to unmask]] Sent: Wednesday, November 26, 2003 10:29 AM To: [log in to unmask]; [log in to unmask] Subject: RE: [TN] Pretinning height on fine-pitch gull wing leads Hi Steve, I forgot to tell that my problem is that our QA rejects parts because the solder has wicked to far onto the leads during pretinning. It's treated like a solder fillet that touches the body, which to my opinion makes no sense. It's not a problem with gold embrittlement. Daan Terstegge Thales Communications Unclassified mail Personal Website: http://www.smtinfo.net --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------