Keith,

Did all of these assemblies happen to have one of the components
replaced/changed that is connected to the open trace?  I am assuming this
is a through-hole PWB.  A broken bit fault would be more random as would an
overall PWB processing defect.  The failures wouldn't manifest in the same
location in every instance.  I'd suspect some latent thermal damage to the
PWB during the assembly process.  The thermal stress from reworking a
through-hole component, if not well controlled, can lead to this type of
failure.

I'd also look at the artwork/master pattern for the PWB and see where the
trace goes.  This may give you a clue where the fault is (again, look at
through-hole rework locations).

Another possibility is electrical overstress.  If the trace in question
carried too high of current, it could burn open.  This would be visible on
a decent xray system.  Causes could be poor design or an external fault to
the card.

The only time I have observed a pattern failure like this that was an
actual PWB defect, it was due to bad artwork.  And we saw those during
production - they did not make it to the field.

Good luck,
-- Gregg



At 10:15 AM 11/12/2003, Keith Calhoun wrote:
>hoping that Technet could once again help me with a vexing problem.  We
>have had a number of boards which have been returned from the field that
>fail during our testing.  We have identified the problem as an open
>trace on an inner layer between one or more IC's and the card edge
>connector.  All of these opens appear to be found on the same inner
>layer, and all the boards which show this failure have the same date
>code on the bare boards.  We have tried to have these boards x-rayed to
>determine if we could find any problems, but we were unable to locate
>any problems.  We can identify the area on the boards as being somewhere
>in about a 2-3 sq. in. area.  I am interested in finding out about any
>other methods, sources, etc which we can use prior to destructive
>investigation of this problem.  Again your help is greatly appreciated.
>

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