A question about processing boards in an SMT assembly low volume, high mix
environment. We spend much of our time setting up and breaking down kits as
our average kit size is only 25-50. Much of this time is spent with IC
parts in tubes (vs. tape and reel or tray). SOIC's were once the high usage
parts, now SSOPs, TSOPs, TSSOPs, MSOPs, etc. are becoming more prominent.
With Fuji IP machines, we seem to be spending too much time trying to find
vibratory feeder inserts that will accommodate these new package types. I'm
trying to find a way to eliminate having to buy multiple inserts of all
possible package types. Is there something out there that streamlines this
process that I've yet to see???? Any input would be appreciated. Thanks.

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