Dear Technetters, The company I work for is developing a relationship with a customer who wants to reclaim BGAs without any baking. During a recent visit to their facility, they were demo-ing an Air-Vac to remove the BGAs. I expressed to them that using an Air-Vac or other automated system compared to a solder pot (which they were initially using) is better because there is less thermal shock to the component because and you can control the environment the chip is exposed to. These are desktop motherboards, so they have been in unknown environments. With few exceptions, they are not interested in the condition of the board after part removal so I recommended setting up their profiles with as much bottom heat as possible and as little top heat as possible. Will a 5 minute or more profile be able to out-gas enough moisture component to significantly reduce the number of heat damaged components? They are removing PBGAs, Ceramic BGAs, FCBGAs, and Cavity Down BGAs. Are any of these more susceptible to popcorning or thermal damage? Thank you in advance for your help everyone. _________________________________________________________________ Is your computer infected with a virus? Find out with a FREE computer virus scan from McAfee. Take the FreeScan now! http://clinic.mcafee.com/clinic/ibuy/campaign.asp?cid=3963 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------