IPC-HDBK-001 page 97 and 98. It depends on thickness but the number in
the handbook is 18-48 hours for 80°C. That will not dry out moisture
sensitive components, just the boards. You might give J-STD-020B a read.
It has a lot of information that may be instructive.

-----Original Message-----
From: TechNet [mailto:[log in to unmask]] On Behalf Of Macko, Joe @ IEC
Sent: Wednesday, October 22, 2003 3:16 PM
To: [log in to unmask]
Subject: [TN] populated board bake out at temperatures below 100 C



Fellow Technets, 

I have been asked to determine the time required to dry out populated
FR-406 boards at 85 C and 95 C.   Since these temperatures are below the
boiling point of water, 100 C, I am not even sure that they will dry out
without some vacuum.  Can anyone point me in the right direction.
thanks

joe 

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