Hi,
Can anyone explain the difference between
immersion silver finishings in PCB and selective plating used in
leadframe?
What is the difference between the 2
processes?
I am trying to understand why is it that gold
wires can be bonded on silver leadframe but does not yield good bond with
immersion silver finishings.
Does the thickness of the silver plays a part for
good bond with gold wires? Does the grain structure play a part
too?
Thanks for sharing.
Best regards,
David.
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