Same here. It is good to know that some of us midgets walk among giants ( figure of speech). We are fortunate to have someone of that statue to comment on specially difficult subjects to give this forum a good direction. Congratulations Ramon > -----Original Message----- > From: Steve Gregory [SMTP:[log in to unmask]] > Sent: Tuesday, October 14, 2003 9:55 PM > To: [log in to unmask] > Subject: Re: [TN] Congratulations Werner! > > I second that!!! > > I would also like to express my thanks to Werner for being an active > participant to our humble forum...his contributions are priceless. > > Not to mention that we all get them for free! > > Thanks again Werner!!! > > -Steve Gregory- > > For those who might have missed it > > "Mr. Reliability" Awarded IPC's 2003 Hall of Fame Award > > NORTHBROOK, Ill., October 7, 2003--IPC-Association Connecting > Electronics Industries® recently honored Werner Engelmaier, Engelmaier > Associates, L.C., with the 2003 Raymond E. Pritchard IPC Hall of Fame > Award at the 2003 IPC Annual Meeting in Minneapolis, Minn. > Based on exceptional lifetime achievement, the Raymond E. Pritchard > IPC Hall of Fame Award is IPC's highest level of recognition, honoring > members who make extraordinary contributions to IPC and the electronic > interconnection industry. > Known as "Mr. Reliability" in the industry for his vast experience > in product reliability, Werner Engelmaier was selected as this year's > recipient for his dedicated service and outstanding industry contributions > over the past three decades. > A founder and current chairman of the IPC Product Reliability > Committee, Engelmaier also currently chairs the IPC Accelerated > Reliability Testing Subcommittee and serves as vice-chair of both the IPC > Plated-Through Hole/Via Reliability and the IPC Plated-Through Hole/Via > Post Separation Task Groups. > A past chairman of the IPC Metal/Copper Foil Committee, Engelmaier > has been an active member of IPC technical committees on flex circuits, > molded printed boards, surface mount land patterns, soldering, test > methods, and the Technical Activities Executive Committee. > Over the years, he has substantially contributed to more than 20 IPC > standards and documents and has represented the reliability point of view > in many others. Engelmaier has published over 145 technical papers and > columns and contributes to IPC's TechNet and Lead Free Forums. > Apart from his service to IPC, Engelmaier has served on an IEEE task > force; become a director of the International Electronics Packaging > Society; chaired two subcommittees and a testing committee for the > American Society of Testing Material; and become a life member of the > American Society of Mechanical Engineers, the International > Microelectronics and Packaging Society. He also was issued two patents and > became a Distinguished Member of the Technical Staff while employed at > Bell Labs. > > --------------------------------------------------- > Technet Mail List provided as a free service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------