Yeah, I think you're right. Usually the component manufacturer offers a version of the component with a nickel barrier over the noble metal which is applied directly to the ceramic. But it the package can't take high temperature, why bother. > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Crepeau, Phil > Sent: Thursday, October 09, 2003 12:56 PM > To: [log in to unmask] > Subject: Re: [TN] Flip Chip Diode 0205 > > > hi, > > i think the issue here is one of using a diode that has a > terminal finish that is best suited to hybrid wire bonding, > conductive adhesive attach, etc. > > tin lead solders wash off the gold which is all there is on > these parts. last i heard, soldering to ceramic is pretty difficult. > > phil > > -----Original Message----- > From: Dave Chapman [mailto:[log in to unmask]] > Sent: Thursday, October 09, 2003 8:47 AM > To: [log in to unmask] > Subject: Re: [TN] Flip Chip Diode 0205 > > > Spec on component says use solder which does not scavenge > gold such as Indalloy #2, or conductive epoxy or low temp > solder preform. Also says cannot withstand 200 C for more > than 10 seconds. Dave C. > > -----Original Message----- > From: Werner Engelmaier [mailto:[log in to unmask]] > Sent: Thursday, October 09, 2003 10:27 AM > To: [log in to unmask] > Subject: Re: [TN] Flip Chip Diode 0205 > > > Hi Dave, > You are not clear as to what "cannot go through Sn-Pb due to > embrittlement" means. Preforms, as well as Sipad are also > Sn-Pb. I have no experience with conductive epoxies, but know > that they are not as good as solder from a reliability perspective. > > Werner Engelmaier --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------