Ramon, The pallet I was referring to would be used to determine the rotational angle of the product as it is introduce to the wave solder. >>> [log in to unmask] 10/21/2003 11:05:59 AM >>> Carl: Did you find this angle to be around 16 degrees? If you can answer this question. Regards, Ramon > -----Original Message----- > From: Carlr Ray [SMTP:[log in to unmask]] > Sent: Tuesday, October 21, 2003 10:44 AM > To: [log in to unmask] > Subject: Re: [TN] SMT Glue and Paste with Wave solder > > Richard, > As an option to try to optimize your wave process have you considered > using a rotary wave pallet? I have used the process of > glue/paste/place/reflow/wave and had good success but depending on the > design of the pcb we still experience some issues. We used a rotary > pallet and performed a DOE to determine the most optimum board > orientation. > Just a suggestion. > > > > Carl Ray > Sr. Manufacturing Engineer > Huntsville, AL 35807 > Phone: 256-882-4800 ext. 8845 > Cell: 256-990-1990 > [log in to unmask] > > >>> [log in to unmask] 10/21/2003 9:00:55 AM >>> > Richard, > > I have done this in a former life with good results on a variety of > boards. And it can be done without a glue dispenser, however you will > then need two screen printers. You first print your paste using a 4 > mil > stencil, then print your glue. The glue stencil will be 8-10 mil, with > underside cavities ~6 mil deep to allow clearance of the glue stencil > to > the pasted pads. Due to the thickness of the glue stencil, you will > require smaller than normal glue apertures. You also need a glue that > does not string to prevent paste contamination during glue stencil > release. You can then run the board through a standard place and > reflow > process, the reflow preheat ramp cures the glue before reflow. > Afterwards, a standard laminar wave will be fine for both your through > hole parts and bottom side discretes. > > Mike > > -----Original Message----- > From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Lepa > Sent: Monday, October 20, 2003 4:35 PM > To: [log in to unmask] > Subject: [TN] SMT Glue and Paste with Wavesolder > > > Hello Technetters, > > We have a very challenging board that has quite a high quantity of SMT > parts on the bottom side, both Rs and Cs and SOICs. The problem is > that > I cannot use the chipwave on the soldering machine because there are > large open areas on the topside of the boards where the solder will > flood through. Since I can't use the chipwave I get a lot of solder > skips in addition to bridging. > > > The question is: Has anyone ever used the glue/paste/place/reflow > process and then used the wavesolder to re-solder the bottomside SMT > parts and solder the thru-hole parts? Are there any inherent problems > with using this process? Would this process reduce reliability of the > parts due to increased stress levels and intermetallics. Your help > will > be greatly appreciated. > > Thanks, > > Richard Lepa > Manufacturing Engineer > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e To > unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt > or > (re-start) delivery of Technet send e-mail to [log in to unmask]: SET > Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the > posts: send e-mail to [log in to unmask]: SET Technet Digest Search the > archives of previous posts at: http://listserv.ipc.org/archives Please > visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for > additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text > in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: > http://listserv.ipc.org/archives > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > ----------------------------------------------------- > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------