Richard, As an option to try to optimize your wave process have you considered using a rotary wave pallet? I have used the process of glue/paste/place/reflow/wave and had good success but depending on the design of the pcb we still experience some issues. We used a rotary pallet and performed a DOE to determine the most optimum board orientation. Just a suggestion. Carl Ray Sr. Manufacturing Engineer Huntsville, AL 35807 Phone: 256-882-4800 ext. 8845 Cell: 256-990-1990 [log in to unmask] >>> [log in to unmask] 10/21/2003 9:00:55 AM >>> Richard, I have done this in a former life with good results on a variety of boards. And it can be done without a glue dispenser, however you will then need two screen printers. You first print your paste using a 4 mil stencil, then print your glue. The glue stencil will be 8-10 mil, with underside cavities ~6 mil deep to allow clearance of the glue stencil to the pasted pads. Due to the thickness of the glue stencil, you will require smaller than normal glue apertures. You also need a glue that does not string to prevent paste contamination during glue stencil release. You can then run the board through a standard place and reflow process, the reflow preheat ramp cures the glue before reflow. Afterwards, a standard laminar wave will be fine for both your through hole parts and bottom side discretes. Mike -----Original Message----- From: TechNet [mailto:[log in to unmask]] On Behalf Of Richard Lepa Sent: Monday, October 20, 2003 4:35 PM To: [log in to unmask] Subject: [TN] SMT Glue and Paste with Wavesolder Hello Technetters, We have a very challenging board that has quite a high quantity of SMT parts on the bottom side, both Rs and Cs and SOICs. The problem is that I cannot use the chipwave on the soldering machine because there are large open areas on the topside of the boards where the solder will flood through. Since I can't use the chipwave I get a lot of solder skips in addition to bridging. The question is: Has anyone ever used the glue/paste/place/reflow process and then used the wavesolder to re-solder the bottomside SMT parts and solder the thru-hole parts? Are there any inherent problems with using this process? Would this process reduce reliability of the parts due to increased stress levels and intermetallics. Your help will be greatly appreciated. Thanks, Richard Lepa Manufacturing Engineer --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------