Ellis: Is it a Hawaiian animal? Ramon > -----Original Message----- > From: Brian Ellis [SMTP:[log in to unmask]] > Sent: Friday, October 24, 2003 11:02 AM > To: [log in to unmask] > Subject: Re: [TN] Cleaning of via holes under components > > I'm a proponent of plugging -- with solder! Not only does it stop the > contamination problem, but it is electrically and thermally desirable, > as well. However, it should be done from only one side unless you like > to see miniature Krakatoas. > > Brian > > Paul Baine wrote: > > Hello, > > > > One of our Design Engineers is designing a surface mount PCB > > assembly and would prefer not to have the via holes solder mask > > tented. However, he is concerned that, if he does not call up > > solder mask tenting on his bare PCB drawing, foreign matter could > > find its way into a via hole and, if a component (e.g. an IC) was > > mounted over the via hole, the foreign matter might not be removed > > during the cleaning process. > > > > Has anyone had experience with this situation? I would appreciate > > any help you could give me. > > > > Thanks very much in advance. > > > > Paul Baine > > Q.A. Manager > > C-Tech Ltd. > > Cornwall, Ontario, Canada > > > > --------------------------------------------------- > > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > > To unsubscribe, send a message to [log in to unmask] with following text > in > > the BODY (NOT the subject field): SIGNOFF Technet > > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > > Search the archives of previous posts at: > http://listserv.ipc.org/archives > > Please visit IPC web site > http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional > information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 > ext.5315 > > ----------------------------------------------------- > > > > > > --------------------------------------------------- > Technet Mail List provided as a service by IPC using LISTSERV 1.8e > To unsubscribe, send a message to [log in to unmask] with following text in > the BODY (NOT the subject field): SIGNOFF Technet > To temporarily halt or (re-start) delivery of Technet send e-mail to > [log in to unmask]: SET Technet NOMAIL or (MAIL) > To receive ONE mailing per day of all the posts: send e-mail to > [log in to unmask]: SET Technet Digest > Search the archives of previous posts at: http://listserv.ipc.org/archives > Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 > for additional information, or contact Keach Sasamori at [log in to unmask] or > 847-509-9700 ext.5315 > ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------