Hello Technetters, We have a very challenging board that has quite a high quantity of SMT parts on the bottom side, both Rs and Cs and SOICs. The problem is that I cannot use the chipwave on the soldering machine because there are large open areas on the topside of the boards where the solder will flood through. Since I can't use the chipwave I get a lot of solder skips in addition to bridging. The question is: Has anyone ever used the glue/paste/place/reflow process and then used the wavesolder to re-solder the bottomside SMT parts and solder the thru-hole parts? Are there any inherent problems with using this process? Would this process reduce reliability of the parts due to increased stress levels and intermetallics. Your help will be greatly appreciated. Thanks, Richard Lepa Manufacturing Engineer --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------