Victor, I stand to be corrected, but to my understanding you cannot use CSAM for PCBs because the glass fibers disperse the signal and no useful information can be collected. X-ray would be tough. Unless you can correlate distance between internal traces examined at an oblique angle, I can't see how you could use x-rays for this problem. Sometimes nothing replaces cross-sectioning. regards, Bev Christian Research in Motion -----Original Message----- From: Victor Hernandez [mailto:[log in to unmask]] Sent: September 3, 2003 12:12 PM To: [log in to unmask] Subject: [TN] PCB delamination Evaluation Fellow TechNetters, Are there any case studies out there that may apply to the following request. Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package. Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile. Victor, --------------------------------------------------- Technet Mail List provided as a free service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------