Fellow TechNetters,
Are there any case studies out there that may apply to the following request.
Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with
destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package.
Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile.
Victor,