PCB delamination Evaluation
Fellow TechNetters,
Are there any case studies out there that may apply to the following request.
Can varying degrees of delamination be identified with CSAM and correlated with x-ray imaging and followed up with
destructive cross section analysis. Is it possible to see the above stated artifact on a PCBA with PBGA package.
Given: The suspected delamination induced by excessive rework, Thermal Excursion and/or too high Assembly Process Profile.
Victor,
---------------------------------------------------
Technet Mail List provided as a free service by IPC using LISTSERV 1.8e
To unsubscribe, send a message to [log in to unmask] with following text in
the BODY (NOT the subject field): SIGNOFF Technet
To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL)
To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest
Search the archives of previous posts at: http://listserv.ipc.org/archives
Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315
-----------------------------------------------------