We build flex circuits with the following construction – 9 or 18 micron copper on 25 micron kapton. Pitch is either 40 micron, 50 micron or 75 micron. The problem we are having is testing. Presently we use flying probe because of a) the density and b) we are concerned about damaging the copper leads which cannot have large dents in them from a bed of nails. I am interested in any feedback on testing methodologies – newer technologies, better methods or any other feedback. Thank you
Steve Kelly
PFC Flexible Circuits Limited
Ph: (416) 750-8433
Fax: (416) 750-0016
Cell: (416) 577-8433
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