Dear Lance:
My sincere apologies for not getting back
to you. It was not intentional. My computer became infected and I had to have
the hard drive reformatted while I was away on a training assignment. As a
result, I didn’t get a chance to check my email for about a week. I just
got back on-line yesterday.
I saw your request on TechNet and think
you got some very good replies. Both Dave Chapman and Bev Christian I respect their
experiences and comments a great deal. I would suggest you go with their opinions.
Some of the responders referred to them as
disturbed which would be a defect for Class 1, 2 and 3 per 9.2.4.2. This is
where the Standards do become subjective. There is a difference between
disturbed “stress lines” and lines of demarcation at the juncture
between the existing solder and new solder. I agree with the comments that
solder is not required to spread to the very end of the pads/lands.
So it comes down to how you interpret the
lines in the solder connection whether disturbed or simply “not pretty”.
If you have a lot of product being produced this way, you could microsection
this connection and have a metallurgist examine it for a final determination. A
disturbed solder connection is one where the solder molecules have not had an opportunity
to properly align during the cooling process. Therefore, the resulting wetting
may be suspect.
The down side of solder connections is
that we infer the internal wetting to the surfaces being joined (and intermetallic
bond between these two surfaces) by simply examining the external surface
conditions.
I hope these comments have be of some
assistance to you.
Sincerely,
Gregg A. Owens
Executive Director
Manufacturing Technology
Training Center, Inc.
10247 San Sevaine Way,
Suite "I"
Mira Loma, CA 91752 USA
Phone: (909) 360-1324
Fax: (909) 360-1346
Website: www.mttc-inc.com
-----Original Message-----
From: TechNet
[mailto:[log in to unmask]] On Behalf Of Lance
Mayes
Sent: Tuesday, September 02, 2003
12:16 PM
To: [log in to unmask]
Subject: [TN] pic's
Importance: High
I have attached some pictures of components that always
seem to have one joint that is not soldered as the other end. These
happed mainly with this component at various sites on the board. Is this
a contamination a disturbed joint or a cold joint. This is an SMT process
and the problems vary
on
the runs. I would like to know if this is a defect for class 2 or not.
Thanks
in advance for your time.
P.
Lance Mayes
Mfg.
Trainer
----- Forwarded by Lance
Mayes/CO-GRA/Ametek on 09/02/03 01:07 PM -----
|
Howard Watson
08/27/03 05:33 PM |
|
Howard Watson
SMT Manufacturing Engineer
AMETEK/Dixson