The Latest in BGA Implementation Strategy

October 8, 2003

1:00 p.m. to 2:00 p.m. (CST)

Today’s electronic equipment uses very complex parts which relate to board design and assembly issues.  Assembly is concerned about attaching all the leads to the mounting structure without bridging (shorts) or missing solder joints (opens).  Design is concerned with interconnecting all the leads and having sufficient room for routing conductors.

This webcast addresses all the concerns that are being expressed by the industry from those contemplating using BGAs to those having to make the processes that produce high quality assemblies.

Topics covered in his presentation include: 

·       Challenges for implementing BGA and Fine Pitch BGA technology
·       Effect BGA and FBGA have on current technology
·       Focus on critical inspection, repair, and reliability issues associated with BGAs
·       Acceptance and how to determine the reliability of the assembly and attachment processes

Participants will have a unique opportunity to obtain firsthand information on implementing issues that affect BGA and FBGA.

If you’re thinking: “Come-on, there’s no way you can teach me all there is to know about BGA implementation in one hour!” You’d probably be right...with one exception: the course instructor is Dieter Bergman, IPC Director of Technology Transfer.

You can’t beat the price and the location could not more perfect. REGISTER TODAY at http://ipcmail.ipc.org/bga_webcast/bga.html.