The Latest in BGA Implementation Strategy October 8, 2003 1:00 p.m. to 2:00 p.m. (CST) Today's electronic equipment uses very complex parts which relate to board design and assembly issues. Assembly is concerned about attaching all the leads to the mounting structure without bridging (shorts) or missing solder joints (opens). Design is concerned with interconnecting all the leads and having sufficient room for routing conductors. This webcast addresses all the concerns that are being expressed by the industry from those contemplating using BGAs to those having to make the processes that produce high quality assemblies. Topics covered in his presentation include: * Challenges for implementing BGA and Fine Pitch BGA technology * Effect BGA and FBGA have on current technology * Focus on critical inspection, repair, and reliability issues associated with BGAs * Acceptance and how to determine the reliability of the assembly and attachment processes Participants will have a unique opportunity to obtain firsthand information on implementing issues that affect BGA and FBGA. If you're thinking: "Come-on, there's no way you can teach me all there is to know about BGA implementation in one hour!" You'd probably be right...with one exception: the course instructor is Dieter Bergman, IPC Director of Technology Transfer. You can't beat the price and the location could not more perfect. REGISTER TODAY at http://ipcmail.ipc.org/bga_webcast/bga.html <http://www.ipc.org> . --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------