Lance,
 
Is this board and are these parts you have shown going through a second pass of double-sided reflow? If these parts are on the first pass on a double-side reflow and do not exhibit these solder joints in question until the 2nd pass then it is the reflow process that is most likely "disturbing" the solder joint. If double sided reflow is the case you can glue the suckers down (I believe their weight and their heat attraction/holding are factors).
 
Dorothy Lush
Manufacturing Manager
i2 Telecom International, Inc.
-----Original Message-----
From: TechNet [mailto:[log in to unmask]]On Behalf Of Lance Mayes
Sent: Tuesday, September 02, 2003 12:16 PM
To: [log in to unmask]
Subject: [TN] pic's
Importance: High


I have attached some pictures of components that always seem to have one joint that is not soldered as the other end.  These happed mainly with this component at various sites on the board.  Is this a contamination a disturbed joint or a cold joint.  This is an SMT process and the problems vary
on the runs.  I would like to know if this is a defect for class 2 or not.

Thanks in advance for your time.


                       P.  Lance Mayes
                       Mfg. Trainer
----- Forwarded by Lance Mayes/CO-GRA/Ametek on 09/02/03 01:07 PM -----
Howard Watson

08/27/03 05:33 PM

       
        To:        Lance Mayes/CO-GRA/Ametek@Ametek
        cc:        
        Subject:        pic's




Howard Watson
SMT Manufacturing Engineer
AMETEK/Dixson
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