Lance,
Is
this board and are these parts you have shown going through a second pass of
double-sided reflow? If these parts are on the first pass on a double-side
reflow and do not exhibit these solder joints in question until the 2nd pass
then it is the reflow process that is most likely "disturbing" the solder joint.
If double sided reflow is the case you can glue the suckers down (I believe
their weight and their heat attraction/holding are factors).
Dorothy Lush
Manufacturing Manager
i2
Telecom International, Inc.
I have attached some
pictures of components that always seem to have one joint that is not soldered
as the other end. These happed mainly with this component at various
sites on the board. Is this a contamination a disturbed joint or a cold
joint. This is an SMT process and the problems vary
on the runs. I would like to know if this is a
defect for class 2 or not.
Thanks
in advance for your time.
P. Lance Mayes
Mfg. Trainer
-----
Forwarded by Lance Mayes/CO-GRA/Ametek on 09/02/03 01:07 PM -----
| Howard Watson
08/27/03 05:33 PM
| To:
Lance Mayes/CO-GRA/Ametek@Ametek cc:
Subject:
pic's |
Howard Watson
SMT Manufacturing Engineer
AMETEK/Dixson
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