Guy, In my previous life I used a batch type vacuum reflow system from Scientific Sealing Technology (http://www.sstinternational.com/index.html) It worked super-well for large, and dense power packages. Void free solder joints were much easier to produce with this equipment using a combination of vacuum and pressure during various stages of reflow. It also works well for tiny stuff. Max temp capability was something like 600C+, but never had to go over ~425C for any reason. Played with forming gas, but it never provided significant benefit over Nitrogen backfill (that I could judge at <400C). The parts are heated by conduction from specific graphite tooling. Tooling was not cheap, but results were quite consistent - as judged by x-ray and acoustic microscopy. Used ones are out there at the equipment re-sale places, but I would be cautious about the condition of the base electrodes and the seals. We took care of ours and got it to pump down much better than factory specs! I could see where a little bit of carelessness could end up making a mediocre system for vacuum reflow. Steven Creswick - Gentex Corporation Zeeland, Michigan - USA -----Original Message----- From: Guy Ramsey [mailto:[log in to unmask]] Sent: Friday, September 12, 2003 2:22 PM To: [log in to unmask] Subject: [TN] Vacuum Furnace We are looking for a manufacture with vacuum furnace in PA (preferably Phila) that can assist with power module assembly using high temp solder. Thanks......!!! Chris Thierolf Electrical Engineer American Competitiveness Institute E-Mail: [log in to unmask] Ph: (610) 362-1200 x212 Fax: (610) 362-1290 --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 ----------------------------------------------------- --------------------------------------------------- Technet Mail List provided as a service by IPC using LISTSERV 1.8e To unsubscribe, send a message to [log in to unmask] with following text in the BODY (NOT the subject field): SIGNOFF Technet To temporarily halt or (re-start) delivery of Technet send e-mail to [log in to unmask]: SET Technet NOMAIL or (MAIL) To receive ONE mailing per day of all the posts: send e-mail to [log in to unmask]: SET Technet Digest Search the archives of previous posts at: http://listserv.ipc.org/archives Please visit IPC web site http://www.ipc.org/contentpage.asp?Pageid=4.3.16 for additional information, or contact Keach Sasamori at [log in to unmask] or 847-509-9700 ext.5315 -----------------------------------------------------