>>>
[log in to unmask] 09/12/03 03:56AM
>>>
We have a customer who is looking at assembling some surface
mount LEDs to a
FR-4 board. We are told that the parts will not stand
conventional reflow
temperatures (they themselves are made with a LMP solder,
and the lens is
temperature sensitive). At this stage, I don't know much more
detail.
The query is whether he could print conventional paste, place the
devices
and then reflow each joint individually, by using a robot. But a
soldering
iron applied the paste will cause spitting, solder balls,
etc.
Perhaps a thermode could be applied to the joint and a temperature
ramp up
applied, which will safely reflow the paste, if such a thing exists
and can
be mounted to a robot.
I would be interested in general
thoughts on how to process these parts.
Maybe not even
solder...
TIA,
Peter
--
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Peter
Swanson
[log in to unmask]INTERTRONICS
http://www.intertronics.co.ukTel:
+44 1865
842842
Oxfordshire, England
INTERTRONICS is dedicated to providing quality
material,
consumable and equipment solutions to high technology
assembly
industries, with the highest levels of technical
support and customer
service.
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