Howard,
We experienced some of your pain when we ran our process without Nitrogen.  Are you using Nitrogen during your reflow ovens?
      In the wave, some of the no-clean flux is 98% water.  The thermodynamics involve mostly getting rid of the water prior to entering the solder pot to ensure adequate pre-heat temperature as well as ensuring that all the water is boiled-off in order to avoid solder explosions and their consequent results evidenced by masses of solder balls at the perimeters of solder openings in the pallet.
 
Hope this helps any..
 
Michael Laroe
Mfg. Engineer
MSL-Lowell
(978)677-2977 (v)
(978)454-9200 (f)
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-----Original Message-----
From: Howard Watson [mailto:[log in to unmask]]
Sent: Thursday, September 11, 2003 1:53 PM
To: [log in to unmask]
Subject: [TN] Effects of humidity on soldering


Hi all,

There is a presumption (not supported with data) here that when it rains, and the humidity goes up, we historically have experienced more solder defects.  I realize that humidity can affect MSD's and PCB's, but what, if any, would be the symptom of high humidity, in terms of solder joint defects at wave and reflow (solder balls,voids)?  Our process is strictly no-clean.  Normally, the humidity in our plant is 10-30%, and when it is high, it's in the 50-60% range, which is probably not even that high compared to some of your plants located in humid climates.  I suspect that our problem may be something other than the humidity.

Also, we don't bake our PCB's, and I'm not sure if it's necessary.  

Howard Watson
SMT Manufacturing Engineer
AMETEK/Dixson
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