Hi Werner and H.,

Just to add some of the experiences I've had with  AgPd finishes on
capacitors, in wave soldering with no lead solders I have completely removed the
termination from the device leaving only the ceramic.  The finish completely
dissolved into the solder.  The only fix I could come up with was to change to a Ni
solder termination on the device.

Larry Tawyea


In a message dated 9/1/03 2:03:50 PM Central Daylight Time,
[log in to unmask] writes:


> Hi H.,
> The raises two questions:
> (1) Where did all the solder go to?
> (2) What is you solder joint height under the component?
> Rework should certainly NOT be the norm.
> And yes, any available Ag will go into solution with the Sn in the solder,
> because of the dissolution rate.
>
> Regards,
> Werner Engelmaier
>
> In a message dated 09/01/2003 2:43:20, [log in to unmask] writes:
> >Hi Werner,
> >There is practically no fillet height, the solder doesn't flow the way
> >it should.
> >If I ad some flux to the joint and reheat the solder the solderjoint is
> >improving but it is still not that great.
> >The best way to make a good solderjoint is to ad fresh solder during rework.
> >I was wondering if there is some truth in the reaction from Guy Ramsey
> >that the Silver is leached into the Tin.
>
> >H. Molema
>
> ---------------------------------------------------
>



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